Universal BGA Reballing Stencil for Phone IC Chip Repair Multifunctional Tin Mesh Solder Template
Precio:
Q135.00
Producto de Tienda Mundial
Ver detalle
Recíbelo entre 11 de Noviembre al 20 de Noviembre
Recíbelo entre 11 de Noviembre al 20 de Noviembre
Garantía:
Verifica las políticas de Tienda Mundial
Elegible para
cuotas.
Cuotas Disponibles por banco
| Cuotas | Monto |
| 3 | Q47.03 |
| 6 | Q23.51 |
| 10 | Q14.31 |
| 12 | Q12.04 |
| 15 | Q9.68 |
| 18 | Q8.14 |
| 24 | Q6.33 |
| 36 | Q4.26 |
| 48 | Q3.22 |
| Cuotas | Monto |
| 3 | Q46.35 |
| 6 | Q23.46 |
| 10 | Q14.07 |
| 12 | Q11.81 |
| 15 | Q9.63 |
| 18 | Q8.03 |
| 24 | Q6.02 |
| 36 | Q4.03 |
| Cuotas | Monto |
| 3 | Q47.03 |
| 6 | Q23.63 |
| 10 | Q14.18 |
| 12 | Q11.81 |
| 18 | Q7.88 |
| 24 | Q5.91 |
| 36 | Q3.94 |
| Cuotas | Monto |
| 3 | Q47.03 |
| 6 | Q23.51 |
| 10 | Q14.18 |
| 12 | Q11.81 |
| 15 | Q9.45 |
| 18 | Q7.88 |
| 24 | Q6.02 |
| 36 | Q4.01 |
| 48 | Q3.01 |
| Cuotas | Monto |
| 2 | Q70.54 |
| 3 | Q47.14 |
| 6 | Q23.74 |
| 10 | Q14.31 |
| 12 | Q12.04 |
| 15 | Q9.77 |
| 18 | Q8.29 |
| Cuotas | Monto |
| 2 | Q70.54 |
| 3 | Q47.03 |
| 6 | Q23.57 |
| 10 | Q14.18 |
| 12 | Q11.81 |
| 15 | Q9.63 |
| 18 | Q8.06 |
| 24 | Q6.08 |
| 36 | Q4.09 |
| 48 | Q3.09 |
| Cuotas | Monto |
| 3 | Q46.08 |
| 6 | Q23.04 |
| 10 | Q13.91 |
| 12 | Q11.64 |
| 15 | Q9.41 |
| 18 | Q7.88 |
| 24 | Q5.93 |
| 36 | Q3.98 |
| 48 | Q3.04 |
| Cuotas | Monto |
| 3 | Q47.14 |
| 6 | Q23.74 |
| 10 | Q14.31 |
| 12 | Q12.04 |
| 15 | Q9.77 |
| 18 | Q8.29 |
Costo de envío: Q20.00
* Precio y unidades sujetos a revisión de Pacifiko
- Producto
- [FOUR PITCHES]: This universal BGA reballing stencil comes with three types of holes with 0.3mm, 0.35mm, 0.4mm, and 0.5mm pitch, offering versatile options for different IC chips.
- [ POSITIONING]: The tin mesh solder template ensures positioning for fast and accurate tin implantation, without any changes under high temperature.
- [COMPACT APPEARANCE]: Designed with a compact appearance, this universal BGA reballing stencil is lightweight, portable, and easy to carry around for on-the- repairs.
- [VERSATILE]: Suitable for common IC chips used in cell phones today, this BGA reballing stencil is versatile and can meet various repair needs.
- [STAINLESS STEEL MATERIAL]: Made from premium stainless steel, the tin mesh solder template is , resistant to damage, and offers a long service life.
Información del producto
| PID | YTJjOWQxZT |
| Número de modelo | B0CL2P1M65 |
| Garantía | 7 días sujeto a las políticas de Tienda Mundial |
Garantía y Soporte
Para más información sobre Garantías en Pacifiko visitar la siguiente pagina: Garantías